 Eetasia.com (subscription) | Infineon optimizes mobile phone chips Eetasia.com (subscription) - Additionally the XMM1020 platform can be realized in a 4-layer PCB and low via count, in a modem area of less than 5cm(SUB>2 and a component count of less ... |
Monday, November 24, 2008
Infineon optimizes mobile phone chips - Eetasia.com (subscription)
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