Infineon Unveils New Chips for Ultra-Low Cost Mobile Phones TMCnet - The XMM1020 platform can be realized in a 4-layer PCB and low via count, in a modem area of less than 5 square centimeters and a component count of less ... |
Tuesday, November 25, 2008
Infineon Unveils New Chips for Ultra-Low Cost Mobile Phones - TMCnet
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