Infineon Petite 3G Platform For HSDPA To HSUPA Phones IQ Online, France - Infineon claims its 3G-solution offering is the industrya s smallest PCB (printed circuit board) footprint with a space reduction of up to 40 per cent. ... |
Friday, May 30, 2008
Infineon Petite 3G Platform For HSDPA To HSUPA Phones - IQ Online
Subscribe to:
Post Comments (Atom)
No comments:
Post a Comment